Comparison ledger
EV Group 301, Lam Research SEZ SP 304, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 301EV Group | SEZ SP 304Lam Research |
|---|---|---|
| OEM | EV Group | Lam Research |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 301 | Lam Research SEZ |
| Specifications | ||
| Cleaning type | Aqueous-based (DI water) megasonic cleaning[2] | — |
| Spinner rotation | Up to 3000 RPM[2] | — |
| DI-water flow rate | Up to 1.5 l/min[2] | — |
| Megasonic nozzle frequency | 1 MHz[2] | — |
| Megasonic nozzle output power | 30–60 W[2] | — |
| Bonding station | Direct bonding (flat to flat) station[2] | — |
| Inspection module | IR-inspection (lamp/camera) module[2] | — |
| Environment | Class 1 mini environment with HEPA filters and ionizer[2] | — |
| Wafer diameter | 200 mm, 100 - 300 mm[3] | — |
| Cleaning system | Aqueous-based (DI water) megasonic cleaning; solvent cleaning option[2] | — |
| Pre-bonding station | Direct bonding (flat to flat) station[2] | — |
| IR-inspection module | IR-inspection (lamp/camera) module[2] | — |
| Class 1 mini environment | HEPA filters + ionizer[2] | — |
| Brush scrubbing option | Available for single-side cleaning[3] | — |
| Substrate size | 200, 100–300 mm[4] | — |
| Rotation speed | up to 3000 rpm[4] | — |
| Megasonic nozzle | frequency 1 MHz, output 30–60 W[4] | — |
| Effective cleaning area | φ4.0 mm[4] | — |
| Power supply | single‑phase 200 V, 50/60 Hz[4] | — |
| Cleaning system type | Open chamber, spinner and cleaning arm[3] | — |
| Chamber material | PP or PFA (option)[3] | — |
| Cleaning media | DI-water (standard), other (option)[3] | — |
| Spinner chuck | vacuum chuck (standard), edge handling chuck (option)[3] | — |
| Rotation | up to 3000 rpm[3] | — |
| Megasonic effective cleaning area | Ø 4.0 mm[3] | — |
| Megasonic nozzle material | PTFE[3] | — |
| Megasonic area transducer frequency | 1 MHz (3 MHz option)[3] | — |
| Megasonic area transducer output power | max. 2.5 W/cm² active areas (max. 200 W)[3] | — |
| Brush material | PVA[3] | — |
| IR-inspection | lamp/camera module[2] | — |
| Configuration | — | Equipped With:[5] |
| Manufacturer | — | Lam Research[6] |
| Model | — | SEZ SP 304[6] |
| Tool type | — | Single wafer processing system[6] |
| Category | — | Wet Processing / Clean[7] |
| Wafer Size | — | 12 inch[6] |
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