Waferpedia

Comparison ledger

DGP 8761versus12 Lapper

Disco DGP 8761, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DGP 8761—
Specifications
ConfigurationInline DFM 2800 mounter / detaper[1]—
Voltage200 V[2]—
Phase3 Phase[2]1[5]
Full Load Current72 A[2]—
Machine Main Breaker Rating90 A[2]—
Rating of Largest Load33 A[2]—
Interrupt Capacity35 kA[2]—
Short Circuit Current Rating5000 A[2]—
Equipment TypePolisher[3]—
Compatible AccessoryWater Temperature Control Unit (DTU series)[4]—
OEMDisco[3]—
ModelDGP 8761[3]—
Applicable product categoryPolisher[4]—
Applicable related equipmentCutting machine, grinder, polisher[4]—
Outside plate diameter—12 inches[5]
Lapping Speed Range—0 to 60 rpm[6]
Wafer Size Compatibility—4 inches or smaller[5]
Input Voltage—110 V[5]
Frequency—60 Hz[5]
Number of Rings—3[5]
Number of Weights—3[5]
Includes Slurry System—Yes[5]
Includes Timer—Yes[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]web.archive.orgweb.archive.org
  5. [5]jmind.comjmind.com
  6. [6]etd.ohiolink.eduetd.ohiolink.edu