Comparison ledger
Disco DFP 8160 Fully Automated, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFP 8160 Fully Automated | — |
| Specifications | ||
| Manufacturer | Disco[1] | — |
| Model | DFP 8160[1] | — |
| Tool type | Fully automated polisher[1] | — |
| Category | CMP[2] | — |
| Wafer size | 8-inch to 12-inch wafers[3] | — |
| Outside plate diameter | — | 12 inches[4] |
| Lapping Speed Range | — | 0 to 60 rpm[5] |
| Wafer Size Compatibility | — | 4 inches or smaller[4] |
| Input Voltage | — | 110 V[4] |
| Frequency | — | 60 Hz[4] |
| Phase | — | 1[4] |
| Number of Rings | — | 3[4] |
| Number of Weights | — | 3[4] |
| Includes Slurry System | — | Yes[4] |
| Includes Timer | — | Yes[4] |