Waferpedia

Comparison ledger

DFL 7160 Laser Dicingversus15

Disco DFL 7160 Laser Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFL 7160Lapmaster 15
Specifications
ConfigurationNon-operational[1]—
Equipment typeFully automatic laser saw[2]—
Max. workpiece sizeΦ300 mm[2]—
Processing methodAblation[2]—
Laser wavelength355 nm[3]—
Laser maximum power18 W[3]—
X-axis processing range310 mm[2]—
Y-axis processing range310 mm[2]—
X-axis moving speed0.1–600 mm/s[2]—
X-axis index step0.0001 mm[2]—
Positioning accuracy0.003/310 mm (single error), 0.002/5 mm[2]—
Z-axis moving resolution0.00005 mm[2]—
Repeatability accuracy0.002 mm[2]—
θ-axis max. rotating angle380 deg[2]—
Equipment dimensions1,200 × 1,550 × 1,800 mm[2]—
Equipment weightApprox. 1,750 kg[2]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.co.jpdisco.co.jp
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org