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Comparison ledger

DFD 651 Automatic Dicingversus15

Disco DFD 651 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFDLapmaster 15
Specifications
ConfigurationNon-operational[1]—
TypeAutomatic Dicing Saw[1]—
Wafer Sizes6 inch, 8 inch[2]—
SpindleDual 1000W Synchro Spindle[3]—
AlignmentMacro/Micro Automatic Alignment[3]—
Cleaning UnitHigh Pressure Spinner Cleaning Unit[3]—
SetupNon Contact Setup[3]—
Broken Blade DetectorYes[3]—
ThetaMotorized 360°[3]—
Monitor12-inch Monitor with Camera[3]—
Chuck Table8-inch Universal Chuck Table[3]—
BBD and NCSYes[4]—
Chuck8-inch Porous Chuck[4]—
Product typeAutomatic Dicing Saw[1]—
MakeDisco[1]—
ModelDFD 651[1]—
OperationAutomatic[1]—
Wafer size6, 8 inch[2]—
OEMDisco[1]—
Equipment typeAutomatic dicing saw[1]—
Vintage1999[2]—
Input Power—110 Vac[5]
Plate Diameter—15 inches (381 mm)[6]
Number of Conditioning Rings—3[6]
Ring ID—5.5 inches (140 mm)[6]
Standard RPM—60[6]
RPM Range (Variable Speed Drive)—0-60[6]
Drive Motor - Lapper—0.5 HP (0.37 kW)[6]
Drive Motor - Polisher—0.75 HP (0.56 kW)[6]
Length—25 inches (635 mm)[6]
Width—20 inches (508 mm)[6]
Height—24 inches (610 mm)[6]
Estimated Shipping Weight—285 lbs (129.3 kg)[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]gtsaz.comgtsaz.com
  4. [4]classoneequipment.comclassoneequipment.com
  5. [5]inventory listing
  6. [6]web.archive.orgweb.archive.org