Waferpedia

Comparison ledger

DAD3241versusR07

Disco DAD3241, Disco R07, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
R07Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAD3241Disco R07
Cited variants—
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
Specifications
Max. workpiece sizeΦ8”[2]Φ8”[2]
X-/Y-axis cutting range210 mm[2]210 mm[2]
Cutting speed0.1-800 mm/s[2]0.1-800 mm/s[2]
Index positioning accuracy0.002/210 mm[2]0.002/210 mm[2]
Z-axis max. stroke32.2 mm[2]32.2 mm[2]
Moving resolution0.000002 mm[2]0.000002 mm[2]
Repeatability accuracy0.001 mm[2]0.001 mm[2]
Θ-axis max. rotating angle320°[2]320°[2]
Rotation speed range6,000-60,000 rpm[2]6,000-60,000 rpm[2]
X-axis cutting range210 mm[2]—
Y-axis cutting range210 mm[2]—
Spindle rated output1.8 kW at 60,000 min-1[4]—
Spindle rated torque0.29 N·m[4]—
Equipment dimensions650 × 950 × 1,670 mm[4]—
Equipment weightApprox. 550 kg[4]—
Axis driveServo motors on all axes (X, Y, and Z)[3]—
InterfaceXIS (Extended Interface System)[3]—
MicroscopeBuilt-in microscope[2]—
Model—DAD3241[2]
Spindle power—1.8 kW[2]
Type—Resin bond blades[1]
Applications—Glass, quartz, ceramics, etc.[1]
Major uses—Glass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[1]
Wafer size—up to Φ8”[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu
  3. [3]disco.com.sgdisco.com.sg
  4. [4]disco.co.jpdisco.co.jp