Waferpedia

Comparison ledger

3220versusTS 23 ID

Disco 3220, Meyer Burger TS 23 ID, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
TS 23 IDMeyer Burger
OEMDiscoMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Meyer Burger TS 23 ID
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Configuration—Refurbished in 2020[3]
Make—Meyer Burger[4]
Model—TS 23[4]
Equipment type—ID Saw[4]
Vintage (one unit)—1985[3]
Refurbished (one unit)—Refurbished in 2020[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]Equipment inventory listing