Comparison ledger
Disco 3220, Meyer Burger OC 266 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | OC 266 WaferMeyer Burger |
|---|---|---|
| OEM | Disco | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Meyer Burger OC 266 Wafer |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Voltage | — | 400V[3] |
| Configuration | — | 150A[3] |
| Frequency | — | 50 Hz[3] |
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