Comparison ledger
Disco 321, Disco R07, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | R07Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | up to Φ8” |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco R07 |
| Cited variants | — | |
| Specifications | ||
| OEM | Disco[2] | — |
| Model | 321[2] | DAD3241[5] |
| Equipment type | Wafer Dicing Saw[2] | — |
| Facility context | Cleanroom Instrumentation[2] | — |
| Application area | Nano and Micro Fabrication[2] | — |
| Location | FNT 4.106[2] | — |
| Wafer Size | Up to 6 inches[3] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4] | — |
| Spindle Power (alternate) | 1500 Watt spindle[3] | — |
| Non-Contact Setup | Non Contact Setup[4] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4] | — |
| Broken Blade Detection | Broken Blade Detection[4] | — |
| Light Tower | Includes Light Tower[4] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[3] | — |
| Wafer size capability | Up to 6" wafers[4] | — |
| Chuck | 6-inch porous film frame chuck[3] | — |
| Spindle power | 1500-watt spindle[3] | 1.8 kW[5] |
| Footprint | Small footprint[3] | — |
| Setup | Non-contact setup[4] | — |
| Blade break detection | Broken blade detection[4] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[4] | — |
| Max. workpiece size | — | Φ8”[5] |
| X-/Y-axis cutting range | — | 210 mm[5] |
| Cutting speed | — | 0.1-800 mm/s[5] |
| Index positioning accuracy | — | 0.002/210 mm[5] |
| Z-axis max. stroke | — | 32.2 mm[5] |
| Moving resolution | — | 0.000002 mm[5] |
| Repeatability accuracy | — | 0.001 mm[5] |
| Θ-axis max. rotating angle | — | 320°[5] |
| Rotation speed range | — | 6,000-60,000 rpm[5] |
| Type | — | Resin bond blades[1] |
| Applications | — | Glass, quartz, ceramics, etc.[1] |
| Major uses | — | Glass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[1] |
| Wafer size | — | up to Φ8”[5] |
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