Comparison ledger
Disco 321, Disco DFL 7160 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DFL 7160 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | Fully automatic laser saw[5] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Configuration | — | Non-operational[4] |
| Max. workpiece size | — | Φ300 mm[5] |
| Processing method | — | Ablation[5] |
| Laser wavelength | — | 355 nm[6] |
| Laser maximum power | — | 18 W[6] |
| X-axis processing range | — | 310 mm[5] |
| Y-axis processing range | — | 310 mm[5] |
| X-axis moving speed | — | 0.1–600 mm/s[5] |
| X-axis index step | — | 0.0001 mm[5] |
| Positioning accuracy | — | 0.003/310 mm (single error), 0.002/5 mm[5] |
| Z-axis moving resolution | — | 0.00005 mm[5] |
| Repeatability accuracy | — | 0.002 mm[5] |
| θ-axis max. rotating angle | — | 380 deg[5] |
| Equipment dimensions | — | 1,200 × 1,550 × 1,800 mm[5] |
| Equipment weight | — | Approx. 1,750 kg[5] |
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