Comparison ledger
Denton Vacuum Discovery Cathode, Perkin Elmer 4400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Discovery CathodeDenton Vacuum | 4400Perkin Elmer |
|---|---|---|
| OEM | Denton Vacuum | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum Discovery | Perkin Elmer 44xx |
| Specifications | ||
| Configuration | 12.0" sputtering system with planetary Load lock and robot loading assemblies[1] | Pump Exhaust GEEX[3] |
| Sputtering system size | 12.0 inch[1] | — |
| Chamber dimensions | Approx. 4' X 6' X 12" Stainless Steel Chamber[1] | — |
| Ion source | Veeco 5 cm Gridded Ion Source with Gas Controls[2] | — |
| High vacuum pump | CTI Cryogenics High Vacuum Pump/Blanket Heater[1] | — |
| Cryopump | Torr400 Cryopump with Oxford E500 Dual Temperature Monitor[1] | — |
| Turbo molecular pump | KYKY F400 Turbo Molecular Pump with FV-LII Pump Controller[1] | — |
| Compressor | CTI-Cryogenics 9600 Compressor[1] | — |
| DC power supplies | (4) Advance Energy Pinnacle plus DC Power Supplies[2] | — |
| Cathodes | (4) 12" Cathodes[1] | — |
| Robot | Loader/Unloader with Epson G6-453c Robot, Vintage 9/10[1] | — |
| Controller | Ion Tech Mps-3000 fc Controller[1] | — |
| Load lock | Load Lock Loader with PLC Controller[1] | Load lock[4] |
| Gate valve | Vat Gate Valve[1] | — |
| Adaptive pressure controller | Vat Adaptive Pressure Controller[1] | — |
| Pressure monitors | Assorted Pressure Monitors[1] | — |
| Isolation valves | Isolation Valves[1] | — |
| Power supply/control | Stand Alone Power Supply/Control[1] | — |
| Computer system | Computer System with Related Hardware/Software[1] | — |
| Manufacturer | Denton Vacuum[1] | — |
| Model | Discovery Cathode[1] | — |
| Category | Deposition[2] | — |
| Process type | Sputtering system[2] | — |
| Wafer size | 12.0-inch[2] | — |
| Wafer handling | Planetary load lock and robot loading assemblies[2] | — |
| Chamber | Approx. 4' x 6' x 12" stainless steel chamber[1] | — |
| Vacuum pumps | CTI Cryogenics high vacuum pump/blanket heater; Torr400 cryopump with Oxford E500 dual temperature monitor; KYKY F400 turbo molecular pump with FV-LII pump controller[1] | — |
| Pressure control | Vat gate valve and Vat adaptive pressure controller[1] | — |
| Control system | Ion Tech Mps-3000 fc controller; stand alone power supply/control; computer system with related hardware/software[1] | — |
| Robot loader/unloader | Epson G6-453c robot[1] | — |
| Handler Type | — | Manual[3] |
| CDA | — | 60-80 psi[3] |
| Chilled Water | — | 68 F, 2 gpm[3] |
| N2 | — | 50 psi[3] |
| HPN2 | — | 60 psi[3] |
| HPAr | — | 10 psi[3] |
| O2 | — | 10 psi[3] |
| Power | — | 208 V, 3 Phase, 60 A[3] |
| Process Type | — | Sputtering / Physical Vapor Deposition[5] |
| Wafer Size | — | 6 inch[6] |
| Sputtering Types | — | DC, RF, DC-RF bias capable[4] |
| Target Positions | — | Ports for four targets; three utilized (two DC with RF bias, one RF)[4] |
| Load Lock | — | Yes[4] |
| RF Etch Option | — | Yes[4] |
| Pump - Main Chamber | — | Cryotorr 8 cryopump with CTI SC (air-cooled) He compressor[4] |
| Pump - Load Lock | — | Pfeiffer turbopump backed by Trivac rotary vane pump[4] |
| Roughing Pump | — | Ebara A10 roots pump[4] |
| Power Supply | — | Present[3] |
| AC Distribution Box | — | Present[3] |
| Heat Exchanger / Chiller | — | Present[3] |
| Backing Pump | — | Present[3] |
| Cryo Compressor | — | Present[3] |
| Mechanical Pump | — | Present[3] |
| CDA Supply | — | 60-80 psi[3] |
| Chilled Water Supply | — | 68 F, 2 gpm[3] |
| N2 Supply | — | 50 psi[3] |
| HPN2 Supply | — | 60 psi[3] |
| HPAr Supply | — | 10 psi[3] |
| O2 Supply | — | 10 psi[3] |
| Power Requirement | — | 208 V, 3 Phase, 60 A[3] |
| Pump Exhaust | — | GEEX[3] |
| GEM / SECS | — | Present[3] |
| Cables | — | All cables present[3] |
| Standard Manual | — | Included[3] |
| CE Mark | — | No[3] |
| Vintage | — | 2004[3] |
| Equipment type | — | Sputtering system[5] |
| Target ports | — | Four target ports[4] |
| Process modes | — | DC and RF, with DC-RF bias capable[4] |
| Options | — | RF etch option[4] |
Plan your fab
Building a Deposition process? Get a complete equipment list.
Open the fab equipment planner →