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Comparison ledger

200 Bake Plateversus450PB

CEE 200 Bake Plate, YES 450PB, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCEEYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200YES 450PB
Cited variants—
  • YES-450PB-HV[1]
Specifications
Wafer sizeup to 200mm wafer[2]200 mm wafers[1]
SoftwareInternal OS[2]—
Voltage208V[2]—
Wafer Sizeup to 200 mm[3]—
Maximum Temperature300 °C[3]—
Bake MethodsHard contact, Proximity (lift 25-100 μm using N2)[3]—
Exhaust CoverYes (removal of fume)[3]—
Smart Pins for Temperature ControlYes[3]—
Series type—MEMS high vacuum cure ovens[1]
Maximum process temperature—Up to 450°C[1]
High vacuum—10-6[1]
Pressure range—50-500 Torr[4]
Laminar flow pressure range—0.50-500 Torr[4]
Process gases—Up to four process gases[4]
Cooling package—Air-only cooling package; no water[1]
Cassette construction—316L SST welded, electro-polished construction with no screws or fasteners[5]
Cassette temperature suitability—316L SST suitable up to 760°C; recommended continuous operating temperature without distortion is 500°C[5]
Cassette sizes—25-wafer cassettes: 2 inch, 3 inch, 100mm, 125mm, 150mm, 150mm short, 200mm, 200mm short, 300mm, and 300mm load port; 13-wafer cassettes: 300 mm and 300mm load port[5]
Equipment type—High vacuum cure oven series[1]
Maximum operating temperature—up to 450°C[1]
Laminar flow—vertical laminar airflow[1]
High vacuum variant—YES-450PB-HV[1]
High vacuum level—10-6 Torr[1]
Cassette material—316L stainless steel, welded and electro-polished construction[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu
  4. [4]web.archive.orgweb.archive.org
  5. [5]web.archive.orgweb.archive.org