Comparison ledger
CEE 1000 Hot Plate, Heller 1900EXL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1900EXLHeller | |
|---|---|---|
| OEM | CEE | Heller |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | Windows |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Heller 1900EXL |
| Specifications | ||
| Configuration | 4"[1] | — |
| Type | Hot Plate[1] | — |
| Wafer Size | 4 inch[1] | — |
| Series | — | EXL Series[2] |
| Heating zones | — | Twelve heating zones[2] |
| Cooling zones | — | Two internal cooling zones[2] |
| Profiling | — | Five thermocouple profiling[2] |
| Line speed | — | Up to 63 inches (1.6 meter) per minute[2] |
| Tool type | — | Forced convection reflow oven[2] |
| Control-system era | — | Windows[3] |
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