Comparison ledger
Besi 2100 FC Plus, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2100 FC PlusBesi | 101-149-053 Gold BoosterBranson |
|---|---|---|
| OEM | Besi | Branson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2100 FC Plus | Branson 101-149-053 Gold Booster |
| Specifications | ||
| Track width | 125mm[1] | — |
| Equipment type | Die bonder[2] | — |
| Bonding method | Flip Chip[3] | — |
| Wafer size | 4" to 12"[3] | — |
| Vintage | 2017[2] | — |
| Configuration | — | 1:1.5[4] |
| Manufacturer | — | Branson[5] |
| Model | — | 101-149-053[5] |
| Type | — | Gold Booster[5] |
| Operating frequency | — | 20 kHz[6] |
| Gain | — | 1:1.5[5] |
| Mounting thread | — | 1/2-20[6] |
| Length | — | 5.4 in[6] |
| Gain ratio | — | 1:1.5[5] |
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