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Comparison ledger

200 ACUversusTelius DRM

Axcelis 200 ACU, Tokyo Electron Telius DRM, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Telius DRMTokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron Telius DRM
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]Tokyo Electron[6]
Model200 ACU[1]Telius DRM[5]
Tool typeAsher[1]—
Wafer size200mm[3]12 inch[5]
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Plasma Etcher[5]
Wafer configuration8 inch[2]—
Category—Etch[6]
Make (as listed)—Tel[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]Equipment inventory listing
  6. [6]waferpedia.comwaferpedia.com