Waferpedia

Comparison ledger

200 ACUversus2300 Kiyo GX RIE

Axcelis 200 ACU, Lam Research 2300 Kiyo GX RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
2300 Kiyo GX RIELam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300
Specifications
ConfigurationParts Machine[1]Poly[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]2300 Kiyo GX[5]
Tool typeAsher[1]Reactive Ion Etcher (RIE)[5]
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Reactive Ion Etcher (RIE)[5]
Wafer configuration8 inch[2]—
Film Type—Polysilicon[5]
FOUP Ports—4[5]
Turbo Pump—Edwards / STP-iXA3306CV[5]
Chiller Unit—ATS / MPX-45FN / 6 units[5]
OEM—Lam[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]inventory listing