Waferpedia

Comparison ledger

Twinscan 1200 Bversus101

ASML Twinscan 1200 B, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMASMLEV Group
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML TwinscanEV Group 101
Specifications
Configurationwith Cymer XLA 160 laser[1]—
LaserCymer XLA 160[2]—
OEM—EV Group[3]
Model—101[3]
Equipment name—EVG 101 Spray Coater[3]
NEMO ID—evgspraycoat[3]
Training required—EVG 101 Training[3]
Training duration—1.50 hours[3]
Processing technique—Resist Spray Coat (manual)[3]
Cleanliness—"All"[3]
Location—SNF Paul G Allen L107 Cleanroom[3]
Wafer diameter (substrate size)—up to 300 mm[4]
Available modules—Spin coat / OmniSpray® / develop[4]
Wafer handling options—Bowed / warped / thin wafer handling, edge handling[4]
Dispense options—Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4]
Processing technique (at SNF)—Resist Spray Coat (manual)[5]
Cleanliness group (at SNF)—"All"[3]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]evgroup.comevgroup.com
  5. [5]snfguide.stanford.edusnfguide.stanford.edu