Comparison ledger
ASML PAS 5500 300 C, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PAS 5500 300 CASML | 101EV Group |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | Wafer Alignment: | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML PAS 5500 | EV Group 101 |
| Cited variants |
| — |
| Specifications | ||
| S/W Ver | 8.9.0[2] | — |
| PC Type | LIPC (Linnux PC)[2] | — |
| Disk Drive | 2 disc RAID system[2] | — |
| Configuration | Projection:[2] | — |
| Wafer Stage Type | Air Bearing Exposure Stage 200mm, SiSiC Wafer Table (Can be set up to run 125-200mm wafers)[2] | — |
| Field Size | 31.1mm Diameter, 22x27.4 Field Size[2] | — |
| Reticle Alignment | TTL Dual Beam Alignment[2] | — |
| Wafer size | Wafer Alignment:[2] | — |
| Model | PAS 5500 / 300 C[2] | 101[3] |
| Illumination source | Cymer ELS 5610[2] | — |
| Wavelength | 248 nm[2] | — |
| Wafer alignment | ATHENA+TIS 3X0 (Off Axis Alignment System)[2] | — |
| Projection optics | Zeiss DUV 4X Double Telecentric[2] | — |
| Numerical aperture | 0.57-0.4[2] | — |
| Resolution | <0.25 um[2] | — |
| Levelling/autofocus | Two measurement systems: coarse red measurement system (820 nm) and fine white measurement system (725-1050 nm)[2] | — |
| Wafer loader | SEMI Standard, 2x Cassette Wafer Transport System, 2x Track Interface Ports[2] | — |
| Control rack position | OCU Mark V-LHS[2] | — |
| Reticle loader | ARMS - 3 Reticle Libraries (SMIF Ports)[2] | — |
| Image Sensor | IQC for fast automated verification of Focus and Overlay[2] | — |
| Barcode Reader | yes[2] | — |
| OEM | — | EV Group[3] |
| Equipment name | — | EVG 101 Spray Coater[3] |
| NEMO ID | — | evgspraycoat[3] |
| Training required | — | EVG 101 Training[3] |
| Training duration | — | 1.50 hours[3] |
| Processing technique | — | Resist Spray Coat (manual)[3] |
| Cleanliness | — | "All"[3] |
| Location | — | SNF Paul G Allen L107 Cleanroom[3] |
| Wafer diameter (substrate size) | — | up to 300 mm[4] |
| Available modules | — | Spin coat / OmniSpray® / develop[4] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[4] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[5] |
| Cleanliness group (at SNF) | — | "All"[3] |
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