Waferpedia

Comparison ledger

Mirraversus100R16

Applied Materials Mirra, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MirraApplied Materials
100R16Strasbaugh
OEMApplied MaterialsStrasbaugh
CategoryCMPCMP
Wafer sizePlaten3 - Wafer Buff—
Process node——
Introduced——
Production run2000–—
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials MirraStrasbaugh 100R16
Cited variants
  • Applied Materials Mirra CMP[1]
  • Mirra[1]
  • Tungsten[1]
  • Dielectric[2]
—
Specifications
SoftwareMP2B6.2_28[1]—
Configuration3 Polish Platens:[1]—
Wafer sizePlaten3 - Wafer Buff[1]—
OEMApplied Materials[1]—
ModelMirra[1]—
Equipment typeCMP (Chemical Mechanical Polisher)[1]—
Polish platens3[1]—
Platen 1STD polish[1]—
Platen 2STD polish[1]—
Platen 3Wafer Buff[1]—
Polish heads4[1]—
Flow controllersEntegris[1]—
Robot armApplied Materials[1]—
Vintage1999[1]—
type—1 spindle grinder/polisher[4]
drive system—DC drive system with 2 motors[4]
spindle RPM—1-180 RPM[4]
eccentric RPM—1-90 RPM[4]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[4]
capacity—16 inches[4]
spindle size—1-8 TPI[4]
overall dimensions—28 inches x 36 inches x 48 inches[4]
weight—500 lbs[4]
origin—made in the USA[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]excelltechnology.comexcelltechnology.com