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Comparison ledger

Centura MXPversusCentura MXP Dry

Applied Materials Centura MXP, Applied Materials Centura MXP Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura MXPApplied Materials
Centura MXP DryApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura MXPApplied Materials Centura MXP
Specifications
Configuration3 CH[1]Polymer[4]
Phase3 Phase[1]—
Frequency50 Hz[1]—
Voltage208 VAC[1]—
WiresFour[2]—
Full Load Current240 A[2]—
H/E 10242-02163 REV D[3]—
UPSDPWR 35611[3]—
H/E (CH-B_C_D_Wall)0242-02163 REV D[3]—
Chambers3 CH[1]—
RobotHP Robot[1]—
Power Supply Voltage208 VAC[1]—
Power Supply Frequency50 Hz[1]—
Number of WiresFour / 4 Wires[1]—
2ch—D/E CH-A/B[4]
Tool type—Dry etcher[5]
Manufacturer—Applied Materials[5]
Wafer size—8 inch[4]
Chamber configuration—2ch D/E CH-A/B[4]
Process configuration—Polymer[4]
Vintage—1996[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com