Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Esec 2100 FC HS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2100 FC HSEsec |
|---|---|---|
| OEM | Applied Materials | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Esec 2100 FC HS |
| Specifications | ||
| Bonding method | — | Flip Chip Bonding[1] |
| Bonding accuracy | — | 8 µm @3s (High Accuracy Mode)[1] |
| Min. cycle time | — | 240 ms (incl. dip fluxing)[1] |
| Wafer size | — | 4" to 12"[1] |
| Frame size | — | 6", 8" and 12"[1] |
| Die size | — | 0.2 to 20 mm[1] |
| Die thickness | — | ≥ 0.05 mm / ≥ 2 mils[1] |
| Strip dimensions | — | Length up to 500 mm; Width up to 125 mm (flat boats up to 137 mm)[1] |
| Machine dimensions | — | 1430 x 1440 x 1400 mm (W x D x H)[1] |
| Weight | — | Approx. 1,400 kg / 3,000 lb[1] |
| Placement speed | — | Up to 16,000 UPH[2] |
| Placement speed without dipping | — | Up to 12,000 UPH[2] |
| Bond force | — | 0.2 N[2] |
| Type | — | Automatic Wafer Die Attach[2] |
| X Y placement accuracy | — | 8 µm[2] |
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