Waferpedia

Comparison ledger

0041-26723 Bonded AssemblyversusEagle 60 AP

Applied Materials 0041-26723 Bonded Assembly, ASM Eagle 60 AP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM Eagle 60
Specifications
Configuration—50/60 Hz[1]
Voltage—240 V[1]
Power supply—240 V, 50/60 Hz, single phase[1]
Electrical—50/60 Hz, 240 V, Single Phase[1]
Equipment type—Wire bonder[2]
Make—ASM[2]
Model—Eagle 60 AP[2]
Vintage—2013[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing