Waferpedia

Comparison ledger

0020 23839 PartversusConcept One 150 PECVD-TEOS

Applied Materials 0020 23839 Part, Lam Research Concept One 150 PECVD-TEOS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsLam Research
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartLam Research Concept One 150
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]Si 02 / TEOS[2]
Phase—3 Phase[2]
Voltage—208 Vac[2]
Wafer Size—6 inch[2]
Process—PECVD-TEOS (Plasma-Enhanced Chemical Vapor Deposition - Tetraethyl Orthosilicate)[2]
Current—100 Current[2]
Deposition Material—Si 02 / TEOS (Silicon Dioxide / Tetraethyl Orthosilicate)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing