Comparison ledger
Applied Materials 0010 47763, Trion Apollo, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | ApolloTrion |
|---|---|---|
| OEM | Applied Materials | Trion |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Trion Apollo |
| Specifications | ||
| Configuration | 2nd Source New[1] | — |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Wafer size | — | 100mm to 300mm[4] |
| Etch rate (photoresist strip) | — | up to 6 µm/min[4] |
| Plasma source options | — | Inductively Coupled Plasma (ICP) or SST-Lightning microwave[5] |
| RF bias | — | Yes (RIE biased electrode)[6] |
| Tuning | — | Self-tuning / automatic tuning[4] |
| Chuck type | — | Electrostatic chuck with helium backside cooling[6] |
| Wafer handling robot | — | Multi-axis atmospheric robot; transports 150mm, 200mm, and 300mm wafers[6] |
| Process controller | — | PC-based with graphical software; recipes stored on 3.5" disks[6] |
| Physical dimensions (W x D x H) | — | 18" x 50" x 51"[6] |
| Maximum wafer size (stated in source) | — | up to 8" (200mm) — note: source also states robot handles 300mm wafers[6] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →