Comparison ledger
Applied Materials 0010 47763, Tokyo Electron TE 8500, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | TE 8500Tokyo Electron |
|---|---|---|
| OEM | Applied Materials | Tokyo Electron |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Tokyo Electron TE 8500 |
| Cited variants | — | |
| Specifications | ||
| Configuration | 2nd Source New[2] | — |
| Type | Monopolar Dual Heated[3] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Model | 0010-47763[2] | — |
| OEM | Applied Materials[2] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[3] | — |
| Quantity available (source) | 1[3] | — |
| Wafer size | — | 6 inch[1] |
| Process type | — | Etch (Dry)[6] |
| Chambers (PESC Dry) | — | 1[1] |
| Application (PESC Dry) | — | Oxide etch with endpoint capability[1] |
| Vintage | — | 1994[6] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →