Waferpedia

Comparison ledger

0010 47763versuseMax CT Plus Dielectric

Applied Materials 0010 47763, Applied Materials eMax CT Plus Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
eMax CT Plus DielectricApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Applied Materials eMax
Specifications
Configuration2nd Source New[1]Alcatel ATH 1600 M Turbo Pump[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Bias—13.5 MHz (Bias) & 2 MHz (LF Bias)[4]
LF Bias—Daihen RMN-50N1[4]
Source—Daihen AMN-30 H 60 MHz[4]
Gate Valve—Nor-Cal / NC-95-PP[4]
FIB—eFib, wFib[4]
Turbo Pump—Alcatel ATH 1600 M[4]
RF Match Box—Included[4]
RF Generator—Included[4]
Chamber Equip Cart—Included[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing