Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Universal Instruments VCD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | VCDUniversal Instruments |
|---|---|---|
| OEM | Applied Materials | Universal Instruments |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Universal Instruments VCD |
| Cited variants | — | |
| Specifications | ||
| Make | Applied Materials[4] | — |
| Model | 0010-22161[4] | — |
| Description | HTESC PH 1 REV A[5] | — |
| Condition | Used[5] | — |
| Stock Number | BM6628[5] | — |
| Throughput | — | 24,500 cph[1] |
| Reliability | — | 200 ppm[1] |
| Component inputs | — | Expandable from 20 to 100 in increments of 20[1] |
| Insertion pitch | — | High-density: 5.00–22.02 mm; High-reliability: 7.62–22.48 mm (optional kit up to 24.00 mm)[1] |
| Topside PCB clearance | — | 20.0 mm[1] |
| Clinch angle | — | 45° to 90°[1] |
| Electrical requirements | — | Single-phase AC 180–246 V, 1150 VA, 47–63 Hz with UPS backup[1] |
| PCB dimensions, automated | — | 102 mm x 80 mm to 483 mm x 406 mm[1] |
| PCB dimensions, manual | — | 51 mm x 51 mm to 600 mm x 600 mm[1] |