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0010-22161 High EFF RF MatchversusBTX-475

Applied Materials 0010-22161 High EFF RF Match, ESPEC BTX-475, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
BTX-475ESPEC
OEMApplied MaterialsESPEC
Category——
Wafer size——
Process node——
Introduced——
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FamilyApplied Materials 0010-22161 High EFF RF MatchESPEC BTX-475
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Documentation—Datasheet (1 document)[3]
Interior Volume—4 cu. ft. (110 L)[4]
Interior Dimensions (W x D x H)—19.6" x 15" x 23.6" (500 x 380 x 600 mm)[4]
Exterior Dimensions (W x D x H)—30.25" x 33.5" x 46" (770 x 850 x 1170 mm)[4]
Temperature Range—-70 to 180 °C (-94 to 354 °F)[4]
Humidity Range—10% - 95% RH[4]
Average Heating Rate—2.75 °C/min (empty, per IEC 60068 3-5, at supply sensor)[4]
Average Cooling Rate—2.5 °C/min (empty, per IEC 60068 3-5, at supply sensor)[4]
Power Requirement—208/230 V, 1ph, 60 Hz, 20 service amps (NEMA 6-20 plug)[4]
Temperature Fluctuation—±0.5 °C (at control sensor)[4]
Humidity Fluctuation—±5% (at control sensor)[4]
Temperature Gradient (Uniformity)—±1.5 °C (below 100 °C, empty)[4]
Humidity Gradient (Uniformity)—±5% (empty)[4]
Weight—Approx. 500 lbs (227 kg)[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]metrologymanuals.commetrologymanuals.com
  4. [4]espec.comespec.com
  5. [5]frankbacon.comfrankbacon.com