Waferpedia

Comparison ledger

0010-21246 PartversusADS 602 H

Applied Materials 0010-21246 Part, Pfeiffer ADS 602 H, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
ADS 602 HPfeiffer
OEMApplied MaterialsPfeiffer
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Pfeiffer ADS 602 H
Cited variants—
Specifications
Type—Multistage Roots dry pump[2]
Ultimate Pressure (60 Hz)—5×10⁻⁴ mbar[1]
Ultimate Pressure (50 Hz)—8×10⁻⁴ mbar[1]
Nominal Flow Rate (50 Hz, without converter)—480 m³/h[1]
Nominal Flow Rate (60 Hz, without converter)—560 m³/h[1]
Nominal Power—3 kW[1]
Supply Voltage—3 Ph 200/480 V[1]
Max Continuous Inlet Pressure—10 mbar[1]
N2 Purge Flow Rate—0 to 50 sl/mn[1]
Cooling Water Flow Rate—60 l/h[1]
Cooling Water Input Temperature Range—+10°C to +35°C[2]
Rotation Speed—3000 to 3600 rpm[1]
Ambient Temperature Range—5 to 40°C[1]
Inlet Port—DN 100 ISO-K[1]
Exhaust Port—DN 40 ISO-KF[1]
Weight—400 kg[1]
Sources (2)Every fact above is drawn from these public sources
  1. [1]ptbsales.comptbsales.com
  2. [2]manualslib.commanualslib.com