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0010-13622 RF Match forversus1CK

Applied Materials 0010-13622 RF Match for, Temescal 1CK, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
1CKTemescal
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forTemescal 1CK
Cited variants—
  • Temescal 3CK SuperSource[1]
  • Temescal 2CK SuperSource[1]
  • Model 1CK[1]
  • 3CK[1]
  • 2CK[1]
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[2]—
Model0010-13622[2]1CK SuperSource[1]
Product TypeRF Match for PVD (Physical Vapor Deposition)[2]—
FeatureHigh Efficiency HE RF Match-Bias[2]—
Rated power—up to 8 kW[1]
Power rating—1–8 kW[1]
Drive options—Side drive or bottom drive[1]
Crucible configurations—4 x 7 cc pockets; 6 x 4 cc pockets[1]
Weight—23.5 lbs. (10.7 kg)[1]
Rotation torque—10 in. lbs. (11.5 kg·cm)[1]
Max bakeout temperature—302 °F (150 °C)[1]
Acceleration voltage—4–10 kV[1]
Operating pressure maximum—5 x 10^-4 torr (6.7 x 10^-4 mbar)[1]
Operating pressure minimum—1 x 10^-4 torr (1.33 x 10^-4 mbar)[1]
Beam deflection—270°[1]
Spot size/shape—From tight oval to diffuse oblong[1]
Evaporation rate reference—25 kÅ of aluminum at 10-in. (254-mm) source-to-substrate distance[1]
Sweep capability—Longitudinal and lateral when operated with a beam sweep controller[1]
Filament current—70 A at 12 V ac[1]
Emission current—0–1.5 A at 4–10 kV dc (8 kW max.)[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing