Comparison ledger
Accretech SS 20 Automatic Dicing, Disco DAD 3350 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SS 20 Automatic DicingAccretech | |
|---|---|---|
| OEM | Accretech | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech SS 20 Automatic Dicing | Disco DAD |
| Cited variants |
| — |
| Specifications | ||
| Max workpiece size (round wafers) | 250 mm[3] | — |
| Max workpiece size (square wafers) | 250 mm[3] | — |
| Spindle speed (standard) | 60,000 rpm[3] | — |
| Spindle speed (optional) | 80,000 rpm[3] | — |
| Display | 17-inch touchscreen[3] | — |
| Kerf check function | Yes[3] | — |
| Maximum wafer diameter (circular) | 250 mm[3] | — |
| Maximum square wafer size | 250 mm x 250 mm[3] | — |
| Maximum sample thickness (tape-mounted) | 1 mm[4] | — |
| Compatible wafer sizes (reported at one facility) | up to 8 inches (200 mm) diameter[4] | — |
| Maximum Power | — | AC 200 V[5] |
| Configuration | — | 50/60 Hz[5] |
| Phase | — | 3 Phase[5] |
| Power | — | 4.9 kVA[5] |
| Voltage | — | 200 VAC[8] |
| Make | — | Disco[5] |
| Model | — | DAD 3350[5] |
| Tool type | — | Automatic dicing saw[5] |
| Power specification | — | AC 200 V, 50/60 Hz, 3-phase[5] |
| Maximum power | — | 4.9 kVA[5] |
| Alternate power specification | — | 200–240 V, 50/60 Hz, 3-phase[7] |
| Spindle power | — | 1.8 kW[7] |
| Maximum cutting diameter | — | 250 mm[7] |
| Supported materials | — | Optical communication V-grooves, glass, printed circuit boards[7] |
| Software version | — | 1.43[6] |
| Unit vintage (2008 unit) | — | 2008[5] |
| Unit vintage (2005 unit) | — | 2005[6] |
| Unit vintage (2012 unit) | — | 2012[7] |
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