Comparison ledger
West Bond 10490, Wyko SP3200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | SP3200Wyko |
|---|---|---|
| OEM | West Bond | Wyko |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10490 | Wyko SP3200 |
| Specifications | ||
| Manufacturer | West Bond[1] | — |
| Model | 10490[1] | — |
| Description | Convertible bonder, wedge to ball[2] | — |
| Tool type | Convertible bonder[3] | — |
| Bonding modes | Wedge bonding and ball bonding[3] | — |
| Use | Wire bonding[3] | — |
| System type | — | Gauge-capable surface profiler[4] |
| Functional roles | — | Surface metrology tool and defect inspection tool[4] |
| Defect inspection capabilities | — | Automatically detects solder bridges, under & oversized bumps, missing & extra solder bumps, and bump position[4] |
| Surface metrology measurements | — | Calculates bump height, diameter, volume, and three-point and regression coplanarity[4] |
| Application software | — | Wyko Vision32 analysis software[5] |
| Software features | — | Specialized algorithms, automation scripting language, integrated database, automatic data logging, and real-time go/no-go feedback[5] |
| Database function | — | Master database allows trending analysis over a product's lifecycle[5] |
| Gauge capability | — | Gauge-capable[4] |
| Primary application | — | In-line process monitoring of flip-chip packaging[4] |
| Metrology functions | — | Surface metrology tool[4] |
| Inspection functions | — | Defect inspection tool[4] |
| Defect detection | — | Automatically detects solder bridges, under and oversized bumps, missing and extra solder bumps, and bump position[4] |
| Surface metrology outputs | — | Bump height, diameter, volume, and three-point and regression coplanarity[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →