Waferpedia

Comparison ledger

10100versus7KF Series

West Bond 10100, West Bond 7KF Series, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
7KF SeriesWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced—1966
Production run—1966–
Lifecycle—Legacy
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 7KF Series
Specifications
Model line—Manual Bonders – 7KF Series[1]
Design—Throat-less chassis and micromanipulator design[1]
Part size access—Unlimited part size access[1]
Applications—Microwave, semiconductor, RF, and hybrid production[1]
Bonding capabilities—45° wedge, 90° feed for wire and ribbon, ball bonding, insulated wire, and single point tab / lead bonding[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]cltrep.comcltrep.com