Comparison ledger
West Bond 10100, West Bond 7476 D 79, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10100West Bond | 7476 D 79West Bond |
|---|---|---|
| OEM | West Bond | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10100 | West Bond 7476 |
| Specifications | ||
| Configuration | — | Olympus SZ 51-60 Microscope[1] |
| Bonding technique | — | manual wedge-wedge wire bonding[2] |
| Minimum bond pad size | — | 50 µm[2] |
| Maximum bond sites before wire parting | — | 21[2] |
| Wire diameter range | — | 0.0007–0.002 inches (17.8–50.8 µm)[2] |
| Supported wire materials | — | aluminum and gold[2] |
| Current wire configuration | — | 0.00125-inch (31.75 µm) aluminum wire[2] |
| Ultrasonic frequency | — | approximately 63 kHz[2] |
| Aluminum wire bonding temperature | — | room temperature[2] |
| Gold wire bonding method | — | heated-stage thermosonic bonding[2] |
| Microscope | — | Olympus SZ 51-60[1] |
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