Tokyo Electron
TE 8401 Dry alternatives
Comparable Etch equipment documented in the Waferpedia catalog.
6 comparable tools
Lam Research
Alliance A 6 Exelan HP Dielectric
Etch
Lam Alliance A 6 Exelan HP Dielectric is an etch tool with an 8-inch wafer size.
Applied Materials
0010 47763
Etch
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
Applied Materials
0010-16392 ESC Assembly
Etch
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Applied Materials
0041-39086 ESC Part
Etch
Oxford Instruments
100 ICP Fluorine
Etch
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
Tegal
1512e
Etch
The Tegal 1512e is an industrial RIE plasma etcher system with modules assembly for CI-4222.
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