Comparison ledger
SUSS MicroTec GT200, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | GT200SUSS MicroTec | 1000FPYES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec GT200 | YES 1000FP |
| Specifications | ||
| Chemical consumption | Significantly lower compared to conventional processes[1] | — |
| Hazardous acids | None used[1] | — |
| Organic solvents | None used[1] | — |
| Wafer size | up to 200 mm[2] | — |
| Throughput | up to 45 wafers per hour[2] | — |
| Particle removal efficiency | 99% for particles >100 nm[2] | — |
| Available modules | TurbulenStrip, CrustBuster, SpinRinseDry[3] | — |
| General dimensions (w x d x h) | 237 x 420 x 230 cm[3] | — |
| Supported wafer materials | Si, SiC, and more[3] | — |
| Robot system | dual arm robot[3] | — |
| System type | — | Plasma cleaning system[4] |
| Line | — | R-Series Plasma Cleaning Systems (Glen Technologies)[4] |
| Model | — | Glen/YES 1000FP[4] |
| Designed use | — | Designed to accept a range of shelf sizes[4] |
| Application focus | — | Changing needs of the flat panel industry[4] |
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