Waferpedia

Comparison ledger

UTC 2000 Superversus10490

Shinkawa UTC 2000 Super, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMShinkawaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyShinkawa UTC 2000 SuperWest Bond 10490
Specifications
ManufacturerShinkawa[1]West Bond[5]
ModelUTC 2000 Super[1]10490[5]
DescriptionWire bonder[2]Convertible bonder, wedge to ball[6]
CategoryPackaging & Bonding[3]—
Vintage2007[2]—
ConditionWorking[4]—
ConfigurationPlease Contact Us (Click)[2]—
OEMShinkawa[1]—
Equipment typeWire bonder[1]—
Serial NoPlease Contact Us[2]—
Tool type—Convertible bonder[7]
Bonding modes—Wedge bonding and ball bonding[7]
Use—Wire bonding[7]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (7)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]asesemiconductor.comasesemiconductor.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]dynamicmos.comdynamicmos.com
  5. [5]Equipment inventory listing
  6. [6]fabsurplus.comfabsurplus.com
  7. [7]waferpedia.comwaferpedia.com