Comparison ledger
Nikon SF 200, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SF 200Nikon | 150 e MaskSUSS MicroTec |
|---|---|---|
| OEM | Nikon | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nikon SF 200 | SUSS MicroTec 150 e Mask |
| Specifications | ||
| Laser | Komatsu[1] | — |
| Resolution | 0.18um[1] | — |
| Wafer loader type | type 3, NC Pre2[1] | — |
| Reticle size | 6"[1] | — |
| Max expose field size | 26mm x 33mm[1] | — |
| Reticle library | Nikon standard (9 slot)[1] | — |
| Configuration | PPD[1] | — |
| Alignment system | LSA, FIA[1] | — |
| Inline | Left in'line[1] | — |
| Chamber type | S61[1] | — |
| Wafer sizes | 8 inch[1] | — |
| PPD | Yes[1] | — |
| Bar code reader | Yes[1] | — |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →