Waferpedia

Comparison ledger

NSR 2205 i 8 A i-Lineversus806

Nikon NSR 2205 i 8 A i-Line, OAI 806, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
806OAI
OEMNikonOAI
CategoryLithographyLithography
Wafer size6"6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNikon NSR 2205OAI 806
Specifications
Resolution0.5µm[1]—
Computer TypePDP11[1]—
Rentical Size5 Inch[1]—
Field Sizes15 / 17.5 / 20mm[1]—
Wafer Size6 Inch Flat[1]—
Reticle Libraries1[1]—
Wafer LoaderType 1[1]—
Wafer sizeWafer Loader Pre-alignment 2[1]—
ConfigurationBarcode Reader[1]—
Wafer Loader Indexers2[1]—
AutofocusSingle Point[1]—
Chuck TypeCeramic Ring Chuck[1]—
Water StageBallscrew[1]—
MCS2 Version2.4B[1]—
Model—OAI 806 Mask Aligner[2]
Patterning substrate size—up to 6 inches[2]
Contact modes—soft, hard, and proximity contact modes[2]
Alignment accuracy—submicron[2]
UV source—collimated UV light source[2]
Workholding—vacuum chuck[2]
Optics—integrated microscope optics[2]
Stage—motorized stage[2]
Optional capability—backside alignment[2]
Substrate size—up to 6 inches[2]
Light source—collimated UV[2]
Backside alignment—optional[2]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]colorado.educolorado.edu