Comparison ledger
MRSI HVM1, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HVM1MRSI | 10490West Bond |
|---|---|---|
| OEM | MRSI | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | MRSI HVM1 | West Bond 10490 |
| Cited variants | — | |
| Specifications | ||
| accuracy | 1 micron level[1] | — |
| machine type | flip-chip die bonder[1] | — |
| application focus | high volume manufacturing[1] | — |
| platform lineage | developed from the MRSI-HVM platform[1] | — |
| supported assembly types | Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB)[1] | — |
| process choices | eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing[1] | — |
| Accuracy | 1 micron[1] | — |
| Process choices | eutectic, epoxy stamping, UV epoxy dispensing, in-situ UV curing[1] | — |
| Assembly types | Chip-on-Carrier (CoC), Chip-on-Submount (CoS), Chip-on-Baseplate (CoB)[1] | — |
| Configurations | conveyor version, heated head version[1] | — |
| Type | Flip-chip die bonder[1] | — |
| Target applications | Chip-on-Carrier (CoC), Chip-on-Submount (CoS), Chip-on-Baseplate (CoB) assembly[1] | — |
| Conveyor version features | Inline conveyor for single fixture or multiple cassette inputs; for AOC, chip-on-PCB, gold-box packaging, and CoC in fixture[1] | — |
| Heated head version features | Heated head on right side; localized top heating at fixed temperature or pulsed heating for eutectic bonding without reflowing neighboring solder pads[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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