Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7KE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7KEWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7KE |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 7KE[2] |
| Equipment type | — | Wire bonder[2] |
| Description | — | Convertible manual wire bonder[2] |
| Intended use | — | Interconnect gold wire leads to various semiconductor devices[2] |
| Wire material noted | — | Aluminum wire available[2] |
| Operation access | — | Limited to users approved and trained by FabLab staff[2] |
| Type | — | Convertible manual wire bonder[2] |
| Wire material | — | Gold (aluminum also available)[2] |
| Operation | — | Manual[2] |
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