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Comparison ledger

1 WBS 1 Wafer Substrateversus7476 E 79 Wedge

Logitech 1 WBS 1 Wafer Substrate, West Bond 7476 E 79 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMLogitechWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateWest Bond 7476
Specifications
Wafer Size6 inch[1]—
Configuration—Deep Access[2]
Memory—Battery Back -Up Ram[2]
Data Entry—Selector Switch[2]
Z Tool Range—0.5625 Inch[2]
Z Encoder Resolution—0.002 Inch[2]
Bond Force Range—Adjustable, 10 To 250 Grams[2]
ESD Protection—Protection Against Electrostatic Discharge[2]
Display—4 Line, 40 Character LCD[2]
Conventional Tool Length—0.750 Inch (7400e)[2]
Micromanipulator—Dual Counterbalanced, Single Lever, 8:1 Ratio[2]
Wire Spool Mount—0.5 Inch With Ball Bearing Rollers[2]
Voltage—110v, 50/60hz, 2a[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing