Waferpedia

Comparison ledger

1 WBS 1 Wafer Substrateversus7400A66 A

Logitech 1 WBS 1 Wafer Substrate, West Bond 7400A66 A, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
7400A66 AWest Bond
OEMLogitechWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateWest Bond 7400A66 A
Specifications
Wafer Size6 inch[1]—
Make—West Bond[2]
Model—7400A66 A[2]
Asset #—74941[2]
Category—Packaging & Bonding[3]
Equipment type—Wire Bonder[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com