Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7400A, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7400AWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7400A |
| Cited variants | — | |
| Specifications | ||
| Wafer Size | 6 inch[3] | — |
| Equipment type | — | Manual wedge wire bonder[1] |
| Configuration | — | 90° vertical feed deep access manual wedge wire bonder[1] |
| Bonding Type | — | Ultrasonic wedge wire bonding[4] |
| Wire Diameter Range | — | 0.7 mil (18 microns) to 4 mil (100 microns), and larger with added features[4] |
| Feed Angle Options | — | 45°, 60°, 90°[1] |
| Manipulator Type | — | Single-lever X-Y-Z manipulator[4] |
| Wire Feed | — | Independent wire feed and work-sensing tool[4] |
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