Comparison ledger
Laurell H6-23, Laurell Lz-23, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H6-23Laurell | Lz-23Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series HL | — |
| Family | Laurell H6-23 | Laurell Lz-23 |
| Cited variants | — |
|
| Specifications | ||
| Maximum rotational speed | 12,000 RPM (based on a ø 100mm silicon wafer)[2] | 12,000 RPM (based on a 100 mm silicon wafer)[1] |
| Wafer capacity | Up to ø 150mm wafers[2] | — |
| Substrate capacity | 5" × 5" (127mm × 127mm) substrates[2] | — |
| Power | 95 to 240VAC, 47/63HZ, ~300 Watts[2] | 95 to 240 VAC, 47/63 Hz, approximately 300 W[1] |
| Category | Spin coater[2] | — |
| Wafer size | Up to 150 mm wafers[2] | — |
| Substrate size | 5 in x 5 in (127 mm x 127 mm) substrates[2] | 5 in × 5 in (127 mm × 127 mm)[1] |
| Speed basis | Based on a 100 mm silicon wafer[2] | — |
| Series | 650-series HL coater system[2] | 650-series[1] |
| Maximum wafer size | — | Up to 150 mm wafers[1] |
| Process controller | — | 650-series process controller[1] |
| Nitrogen/CDA process/seal purge | — | 60–70 PSIG (4–5 bar)[1] |
| Vacuum suggestion | — | 25–28 inches Hg with a flow volume of 4.5 SCFM at 0 inches Hg[1] |
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