Comparison ledger
Laurell H6-15, Laurell WS-650-15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H6-15Laurell | WS-650-15Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | 650-series |
| Family | Laurell H6-15 | Laurell WS-650-15 |
| Cited variants | — | |
| Specifications | ||
| Model | H6-15[4] | WS-650-15[1] |
| Series | 650-series HL coater system[4] | — |
| Maximum wafer size | Up to ø 300mm wafers[4] | — |
| Maximum substrate size | 9" × 9" (229mm × 229mm) substrates[4] | — |
| Maximum rotational speed | 12,000 RPM[4] | 12,000 RPM (based on a ø 100mm silicon wafer)[1] |
| Controller/software | Wireless tablet featuring Laurell Touch process control software; accompanying PC software Spin 3000 is also mentioned[4] | — |
| Power | 95 to 240VAC, 47/63HZ, ~300 Watts[4] | 95 to 240VAC, 47/63HZ, ~300 Watts[1] |
| Required nitrogen/CDA purge | 60–70 PSIG (4–5 bar)[4] | — |
| Vacuum | 25–28 inches Hg suggested; 4.5 SCFM at 0 inches Hg[4] | — |
| Wafer size | up to ø 300mm wafers[4] | — |
| Substrate size | 9" × 9" (229mm × 229mm) substrates[4] | — |
| Speed basis | based on a ø 100mm silicon wafer[4] | Based on a 100mm silicon wafer[1] |
| Control software | Laurell Touch process control software with accompanying Spin 3000 PC software[4] | — |
| Controller | wireless tablet[4] | — |
| Gas purge | 60–70 PSIG Nitrogen/CDA[4] | — |
| Wafer capacity | — | up to ø 300mm wafers[1] |
| Substrate capacity | — | 9" × 9" (229mm × 229mm) substrates[1] |
| Configuration | — | Station mounted[1] |
| Process controller | — | 650-series process controller[1] |
| Processes supported | — | Coating, Etching, Developing, Rinsing-Drying and Cleaning[1] |
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