Waferpedia

Comparison ledger

H6-15versusH6-23

Laurell H6-15, Laurell H6-23, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
H6-15Laurell
H6-23Laurell
OEMLaurellLaurell
CategorySpin coaterSpin coater
Wafer size300mm150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—650-series HL
FamilyLaurell H6-15Laurell H6-23
Specifications
ModelH6-15[1]—
Series650-series HL coater system[1]650-series HL coater system[2]
Maximum wafer sizeUp to ø 300mm wafers[1]—
Maximum substrate size9" × 9" (229mm × 229mm) substrates[1]—
Maximum rotational speed12,000 RPM[1]12,000 RPM (based on a ø 100mm silicon wafer)[2]
Controller/softwareWireless tablet featuring Laurell Touch process control software; accompanying PC software Spin 3000 is also mentioned[1]—
Power95 to 240VAC, 47/63HZ, ~300 Watts[1]95 to 240VAC, 47/63HZ, ~300 Watts[2]
Required nitrogen/CDA purge60–70 PSIG (4–5 bar)[1]—
Vacuum25–28 inches Hg suggested; 4.5 SCFM at 0 inches Hg[1]—
Wafer sizeup to ø 300mm wafers[1]Up to 150 mm wafers[2]
Substrate size9" × 9" (229mm × 229mm) substrates[1]5 in x 5 in (127 mm x 127 mm) substrates[2]
Speed basisbased on a ø 100mm silicon wafer[1]Based on a 100 mm silicon wafer[2]
Control softwareLaurell Touch process control software with accompanying Spin 3000 PC software[1]—
Controllerwireless tablet[1]—
Gas purge60–70 PSIG Nitrogen/CDA[1]—
Wafer capacity—Up to ø 150mm wafers[2]
Substrate capacity—5" × 5" (127mm × 127mm) substrates[2]
Category—Spin coater[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org