Comparison ledger
Laurell EDC-HL-23, Laurell WS-650-15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-HL-23Laurell | WS-650-15Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series | 650-series |
| Family | Laurell EDC-HL-23 | Laurell WS-650-15 |
| Cited variants |
| |
| Specifications | ||
| Process controller | 650-series process controller[1] | 650-series process controller[2] |
| Wafer capacity | Up to 150 mm wafers[1] | up to ø 300mm wafers[2] |
| Substrate capacity | Up to 5 in x 5 in (127 mm x 127 mm) substrates[1] | 9" × 9" (229mm × 229mm) substrates[2] |
| Maximum rotation capability | 12,000 RPM with vacuum hold-down[1] | — |
| Recommended operating speed | 3,000 RPM with non-vacuum chucks[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | 95 to 240VAC, 47/63HZ, ~300 Watts[2] |
| Nitrogen/CDA seal purge pressure | 60–70 PSIG (4–5 bar)[1] | — |
| Vacuum recommendation | 25–28 inches Hg with 4.5 SCFM at 0 inches Hg[1] | — |
| Maximum rotational speed | — | 12,000 RPM (based on a ø 100mm silicon wafer)[2] |
| Model | — | WS-650-15[2] |
| Configuration | — | Station mounted[2] |
| Speed basis | — | Based on a 100mm silicon wafer[2] |
| Processes supported | — | Coating, Etching, Developing, Rinsing-Drying and Cleaning[2] |
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