Waferpedia

Comparison ledger

12 LapperversusWG6

Lapmaster 12 Lapper, Logitech WG6, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
WG6Logitech
OEMLapmasterLogitech
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system—GUI
Generation——
Family—Logitech WG6
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]—
Phase1[1]—
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
System composition—PM6 or LP70 precision polishing machine plus WG6 polishing head[3]
Batch capacity—Up to 6 samples at one time[3]
LP70 capacity with two WG6 heads—Up to 12 specimens at one time[3]
Polishing head speed—Up to 35 rpm[3]
Incremental load per drive rod—Up to 1.4 kg on each individual drive rod[3]
Drive rods—Six drive rods[3]
Motor—Powerful, low voltage DC motor[3]
Material—Corrosion resistant materials[3]
Large specimen example size—76 x 51 mm[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]web.archive.orgweb.archive.org