Waferpedia

Comparison ledger

12 LapperversusPM 2 Surface Polishing

Lapmaster 12 Lapper, Logitech PM 2 Surface Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMLapmasterLogitech
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Logitech PM 2 Surface Polishing
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]60 Hz[4]
Phase1[1]Single phase[4]
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Configuration—110 Volts[3]
Power & electrical—110 Volts[4]
Current—3 Amps[4]
Asset #—142902[3]
Make—Logitech[3]
Model—PM 2[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com